Weaker bonding can give larger thermal conductance at highly mismatched interfaces
نویسندگان
چکیده
منابع مشابه
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Wen-Pin Hsieh,1,2,* Austin S. Lyons,3,4 Eric Pop,3,4,5 Pawel Keblinski,6 and David G. Cahill2,7 1Department of Physics, University of Illinois, Urbana, Illinois 61801, USA 2Frederick-Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA 3Micro and Nanotechnology Lab, University of Illinois, Urbana, Illinois 61801, USA 4Department of Electrical and Computer Eng...
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ژورنال
عنوان ژورنال: Science Advances
سال: 2021
ISSN: 2375-2548
DOI: 10.1126/sciadv.abf8197